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Pressure
On-chip Temperature Compensation and Calibration
Figure 2 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 867). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MPVZ5150 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Stainless
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 3 . The
output will saturate outside of the specified pressure range.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Gel Die Coat
Die
Steel Cap
+5 V
P1
Wire Bond
Thermoplastic
Case
V out
OUTPUT
V s
Lead Frame
IPS
Differential Sensing
P2
Die Bond
1.0 μ F
0.01 μ F
GND
470 pF
Element
Figure 2. Cross-Sectional Diagram (not to scale)
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to Application
Note AN1646)
5
4
3
V out = V S *(0.006*P(kPa)+0.04)
± (PE * TM * 0.006 * Vs)
V S = 5.0 V ± 0.25 Vdc
PE = 3.75 kPa
TM = 1 @ 0 to 85°C
TM = 3 @ +125°C
TM = 3 @ -40°C
Vs = 5.0 V +/- 0.25 Vdc
2
1
0
MAX
TYP
Pressure (kPa)
MIN
(Typ)
Offset
Figure 4. Output vs. Pressure Differential
MPVZ5150
Sensors
4
Freescale Semiconductor
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